Start typing and press Enter to search

This website does not support Internet Explorer. For a correct visualization we recommend to use Microsoft Edge or Google Chrome.

APPLICATIONS

BATTERIES

< All applications

In our increasingly electrified world, batteries play a pivotal role in powering everything from electric vehicles to portable electronics. Sensofar’s Non-contact 3D optical systems are ideal for measuring surface texture, flatness, and critical dimensions of batteries, providing crucial insights for enhancing battery efficiency, lifespan, and safety.

Heat sink flatness

heat-sink_flatness

The flatness of the heat sink is a critical factor in the performance of a battery. As a passive cooling device that dissipates the heat generated by the battery modules, the warpage of the heat sink can significantly impact battery efficiency. In this scenario, it is Fringe Projection technology that can better assess it, providing fast and micron-level accuracy measurements.

heat-sink_flatness
log66-01l-a-sensoview

SensoVIEW analysis software offers an operator that simplifies the calculation of flatness parameters following ISO 12920.

heat-sink_flatness

Battery separator defect inspection

Battery separator

The primary safety element of a cell is the battery separator, which prevents direct contact between the two electrodes responsible for the flow of electrons during the operation of the battery. Optical areal measurements help to assess whether the irregularities on the surface of battery separators will or will not impact the overall performance and safety of the battery.

Battery separator
log66-01l-a-sensoview

Coplanarity of BGA

Coplanarity of BGA

Ball Grid Array (BGA) is an electronic packaging technology that utilizes solder balls to establish electrical connections between components and circuit boards. In the context of SiP batteries, it helps to save space.

Coplanarity of BGA
Bumps analysis
SensoPRO sw logo

The Bumps plugin automates the detection of bump-like structures and provides a range of parameters. Coplanarity is particularly crucial as it measures variations in bump heights. The height uniformity of BGA pins determines the connection reliability.

Solutions

Non-contact 3D surface metrology

S neox 3D optical systems for Industry and research
S wide 3D optical systems for Industry and research
s-lynx-industry-and-reasearch_2022

Integrable metrology

Integrable Head S neox
Integratable Head S mart
Integratable Head S onix
conversation-icon_medium300x183

Get answers to your questions!
Connect with an expert

Just write us an email or search for
a direct contact near you.

conversation-icon_medium

Get answers to your questions!
Connect with an expert

Just write us an email or search for
a direct contact near you.