Start typing and press Enter to search

This website does not support Internet Explorer. For a correct visualization we recommend to use Microsoft Edge or Google Chrome.


Sensofar Medical inspection technology is adapted for the measurement of heart valves, inspectioning the metallic frames conforming the main structure of Transcatheter Aortic Valve Implants (TAVI) and Transcatheter Mitral Valve Replacements (TMVR). The size of these stent-like components usually ranges between 20mm and 32mm OD, with lengths around 35mm and are made of metallic alloys like CoCr or NiTinol.

Heart Valves Dimensions

Dimensional analysis

Dimensional analysis

In terms of dimensional analysis, the inspection and measurement of the heart valves frame is equivalent to that of a coronary or a peripheral stent, where dimensions are accurately measured in Regions of Interest defined along the stent according to the design drawing.

SensoINSPECT incorporates additional tools to manually measure angles or radius of curvature on more complex structures that are present in heart valve designs.

Heart Valves Dimensions
Grazing Illumination

Defect detection

Visual inspection in heart valve frames is way more critical than it is in stents given that heart valves are constantly affected by radial force produced by heartbeats after being implanted. As opposed to stents, any micro-crack present on a heart valve frame can evolve into a fracture of one of the struts time after of being implanted, which would be terrible for the patient.
In order to avoid the risk of missing any small defects in the critical areas of the heart valve frame, Sensofar Medical has designed a light sources support for Q vix that allows to accommodate up to 7 light sources to provide a unique combination of bright field and grazing illumination of the device surface. This combination enables the detection of tiny defects that can be seen “shining in the dark” even at low magnifications, while keeping the capability of detection surface defects in the outer and inner surfaces of the devices.