APPLICATIONS

BGA (Ball Grid Array) packaging is a structure for Surface Mount packaging. The inspection is only completed after checking each ball to ensure a good connection with the PCB. Our S neox, used alongside SensoPRO provides a fast and fully automated solution to measure the height of each ball.

When there are parts that need to be characterized in multiple ways such as this thermal pad, SensoPRO has a solution: it can analyze the sample with different plugins simultaneously, getting a very comprehensive analysis.

Technology always pushes limits. Sensofar wants to be at the forefront. Vanguard technologies reduced the diameter of gold wires down to 30 µm, a significant improvement.
SensoVIEW can create as many profiles as needed and measure critical dimensions. This example shows the height difference between the maximum point of the wire and the chip since that parameter will determine whether or not the cable makes contact with the chip’s cover.

One of the most popular IC packaging types is the QFN (Quad-flat No Lead) packages because they are suitable for many users in consumer, automotive, or power applications. The flatness of the pins is the evaluated element. Using the SensoVIEW profile tool we can evaluate the flatness of the pins.

Flatness (Sz) is crucial to ensure a good attachment between a pad and the bottom of a chip to allow proper heat dissipation.
Flatness assessment is straightforward with SensoVIEW. To avoid possible spikes in the measurement, we apply leveling and thresholding and then we get the Sz value. SensoVIEW calculates roughness parameters on the dataset, by default. Then we need just to save this processing and apply it to the dataset.