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single-line.plugin

Wafer Groove Single Line

PCB | SEMICONDUCTOR

This plugin characterizes in detail the first cut of the dicing process. To do so, it measures multiple dimensions of dicing traces made with lasers. Wafer Groove Single Line will detect one trace within the topography.

parameters_sensopro_wg-single-line
single.line_.plugin
Single Line wafer Groove plugin graph
Single Line wafer Groove plugin parameters
two-lines.plugin

Wafer Groove Two Lines

PCB | SEMICONDUCTOR

This plugin characterizes in detail the first cut of the dicing process. To do so, it measures multiple dimensions of dicing traces made with lasers. Wafer Groove Two Lines will detect two traces within the topography.

parameters_sensopro_wg-two-line
two.lines_.plugin
wf-two-lines-graph2
Two lines wafer Groove plugin parameters
single.line_.far_.plugin.1

Wafer Groove Single Line Far

PCB | SEMICONDUCTOR

This plugin characterizes in detail the first cut of the dicing process. To do so, it measures multiple dimensions of dicing traces made with lasers. Wafer Groove Single Line will detect one trace within the topography.

parameters_sensopro_wg-single-line-far
single.line_.far_.plugin
Single line far Wafer groove plugin graph
graph-wf-single.line_.far_
wg_two_lines_far

Wafer Groove Two Lines Far

PCB | SEMICONDUCTOR

This plugin is used in the semiconductor manufacturing process to analyze three cuts made during dicing. It can calculate parameters from six trace lines to improve the manufacturing process. Integrators can include it with other plugins like Wafer Groove Single Line and Wafer Groove Two Lines to automate the cut analysis, reducing manual intervention and making the process more efficient.

parameters_sensopro_wg-two-line
wg_two_lines_far_plugin
wg_two_lines_far_graph1
wg_two_lines_far_graph

Also, these four plugins bring an exciting display of detection. Find in the following graph a cross-section of the topography in which the points considered for the calculations are shown:

wf-two-lines-graph
analisis.wf-lines