For semiconductor applications, Sensofar’s products can characterize critical dimensions, roughness, and perform defect inspection, frequently within the back-end packaging of the manufacturing process.
Wafer warping through structure measurement
This wafer has been through different processes which explain its characterization: firstly, a texturizing process, making it quite rough and, consequently, measurable with the S wide.
Secondly, an epitaxy growth has been carried out and with it the wafer has been exposed to high temperatures, leading to potential wafer deformation. To assess that, we have measured the distances between its structures with SensoVIEW, to see if they match the expected lengths.
3D Cross Kerf
Chip segmentation has two main dimensions to characterize: height, to ensure that the bottom is not damaged, and width, which is a measure of the quality of the cut. Cross kerf plugin not only detects the cross and extracts the desired parameters but also levels the surface to make sure that an existing angle in the wafer doesn’t affect the extracted data. The high aspect ratio of those dimensions is challenging and only Ai Focus Variation can resolve this application.