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TB Glue plugin 3D

TB glue

SEMICONDUCTOR

SEMICONDUCTOR

This plugin is developed for wafer applications to evaluate adhesive deposition on silicon-based surfaces. It focuses on key height parameters, including minimum, maximum, and average glue height relative to the silicon surface, supporting reliable assessment of adhesive uniformity and process control.

This plugin is developed for wafer applications to evaluate adhesive deposition on silicon-based surfaces. It focuses on key height parameters, including minimum, maximum, and average glue height relative to the silicon surface, supporting reliable assessment of adhesive uniformity and process control.

TB Glue plugin parameters
TB Glue plugin 2D
TB Glue plugin results
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