
TB glue
SEMICONDUCTOR
SEMICONDUCTOR
This plugin is developed for wafer applications to evaluate adhesive deposition on silicon-based surfaces. It focuses on key height parameters, including minimum, maximum, and average glue height relative to the silicon surface, supporting reliable assessment of adhesive uniformity and process control.
This plugin is developed for wafer applications to evaluate adhesive deposition on silicon-based surfaces. It focuses on key height parameters, including minimum, maximum, and average glue height relative to the silicon surface, supporting reliable assessment of adhesive uniformity and process control.







