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TB Glue

半导体

该插件专为晶圆应用开发，用于评估硅基表面上的胶水沉积情况。重点分析关键高度参数，包括相对于硅表面的最小、最大和平均胶层高度，从而支持对胶层均匀性和工艺控制的可靠评估。

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TB Glue

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