
Trim2
ADVANCED PACKAGING | SEMICONDUCTOR
ADVANCED PACKAGING | SEMICONDUCTOR
This plugin automatically measures key geometric parameters in 2.5D packaging wafers. It calculates the average widths of the middle and bottom wafers, as well as the height between wafer levels. This plugin supports analysis of stacked wafers with different diameters, where laser grooves create characteristic edge steps.
This plugin automatically measures key geometric parameters in 2.5D packaging wafers. It calculates the average widths of the middle and bottom wafers, as well as the height between wafer levels. This plugin supports analysis of stacked wafers with different diameters, where laser grooves create characteristic edge steps.







