Precision 3D metrology for Semiconductor Manufacturing
David erwarb seinen Bachelor an der Polytechnischen Universität von Katalonien (UPC), wo er als Forschungsassistent in der Abteilung für Physik tätig war. Nach Abschluss seines Masterstudiums an der Universität Barcelona (UB) stieg er bei Sensofar in die Welt der optischen Messtechnik ein. Als Vertriebsspezialist vermittelt er das Wissen, das Sensofar über optische Messtechnik verfügt und schult unsere Kunden, damit sie das volle Potenzial unserer Systeme ausschöpfen können. Sollten Sie einmal bei uns vorbeischauen, finden Sie ihn sicherlich in Demo-Raum, wo er Proben misst oder Live-Demonstrationen durchführt.
While the semiconductor industry continues to push the limits of device performance and miniaturization, 3D metrology remains essential for achieving consistent yield, reliable quality, and faster time-to-market.
In this webinar, discover how 3D optical metrology meets the challenges posed by both front-end and back-end semiconductor manufacturing. You’ll learn about cutting-edge automation for in-line inspection, best practices for advanced packaging and heterogeneous integration evaluation, and real-world applications from wafer-level testing to final device verification.
Join us to see how Sensofar’s metrology solutions can help keep you ahead in the rapidly evolving semiconductor landscape.
KEY TOPICS
Critical role of 3D metrology for semiconductor manufacturing
Gain a clear understanding of the key challenges in today’s shrinking geometries and tight tolerances. Discover how non-contact 3D surface measurements optimize process control, reduce defects, and increase yield in both front-end and back-end semiconductor production.
Leveraging Automation for High-Volume/High-Yield Environments
Learn how automated acquisition and analysis streamline inspection steps, reduce manual errors, and accelerate decision-making in high-throughput fabs. Discover how integrable systems ensure consistent quality and cost-effectiveness at every semiconductor manufacturing step.
Tackling next-gen chips: advanced packaging and heterogeneous integration
Dive into the specific metrology needs of emerging packaging technologies, like 2.5D and 3D packaging, wafer and panel-level packaging, and co-packaged optics. Understand how 3D optical metrology addresses critical inspection requirements to ensure product reliability in the face of increasingly complex integration.
Real-world Applications Across the Semiconductor Supply Chain
See how semiconductor leaders integrate 3D measurement at wafer-level testing, post-bond inspection, and final device verification. Uncover proven strategies for catching defects early, reducing scrap, and maintaining quality throughout multi-site supply chains.
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