After all the manufacturing process of a PCB, the flatness of the board is checked to ensure that the PCB fits well in its packaging. Flatness is characterized with the Sz parameter, calculated in SensoVIEW by default.
We can see where the highest and lowest points are located because SensoVIEW’s profiling options include the possibility to draw profiles with the highest and lowest points included.
under dry film
Interferometry and Confocal thickness are key technologies for this application. We can use both technologies to see which one images better through the layer, but also to verify and correct the results when the layer affects the measured height.
FTrace plugin automatically detects traces in different directions. All the plugins in SensoPRO have the possibility to see the tendency of values per each parameter.
These structures are the base of the pins that the chip will have. Their position, height and diameter will determine the bump-pin union.
The Bump plugin can analyze up to 14.500 bumps.
Solder Mask layers are usually applied to printed circuit boards (PCB) as protective layers. Openings for connections can have multiple connectors. The Solder mask plugin can easily recognize the different configurations and analyze the key parameters.
Laser cutting is one of the main front-end processes in the semiconductors field. In the case of PCBs, it is used for fabricating bias and channels of communication that are characterized (barbs, depth, etc.).
Grove profile plugin has been developed to analyze different structures generated with laser methodology.