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网络研讨会和讲座

Precision 3D metrology for Semiconductor Manufacturing

网络研讨会和讲座
David Páez
销售支持专家,工程物理理学士,纳米科学和纳米技术理学硕士 at Sensofar Metrology |  Other articles

David 在加泰罗尼亚理工大学 (UPC) 获得学士学位,并在物理系开始了研究助理的工作。在巴塞罗那大学 (UB) 完成硕士学位后,他加入了 Sensofar,从事光学测量领域。作为销售专家,他传播 Sensofar 的光学测量知识,为我们的客户进行培训,教授他们如何挖掘我们系统的全部潜力。如果您想找他,他很可能就在我们的演示室,测量样品或进行现场演示。

While the semiconductor industry continues to push the limits of device performance and miniaturization, 3D metrology remains essential for achieving consistent yield, reliable quality, and faster time-to-market.

In this webinar, discover how 3D optical metrology meets the challenges posed by both front-end and back-end semiconductor manufacturing. You’ll learn about cutting-edge automation for in-line inspection, best practices for advanced packaging and heterogeneous integration evaluation, and real-world applications from wafer-level testing to final device verification.

Join us to see how Sensofar’s metrology solutions can help keep you ahead in the rapidly evolving semiconductor landscape.

KEY TOPICS

   Critical role of 3D metrology for semiconductor manufacturing
Gain a clear understanding of the key challenges in today’s shrinking geometries and tight tolerances. Discover how non-contact 3D surface measurements optimize process control, reduce defects, and increase yield in both front-end and back-end semiconductor production.

  Leveraging Automation for High-Volume/High-Yield Environments
Learn how automated acquisition and analysis streamline inspection steps, reduce manual errors, and accelerate decision-making in high-throughput fabs. Discover how integrable systems ensure consistent quality and cost-effectiveness at every semiconductor manufacturing step.

  Tackling next-gen chips: advanced packaging and heterogeneous integration
Dive into the specific metrology needs of emerging packaging technologies, like 2.5D and 3D packaging, wafer and panel-level packaging, and co-packaged optics. Understand how 3D optical metrology addresses critical inspection requirements to ensure product reliability in the face of increasingly complex integration.

  Real-world Applications Across the Semiconductor Supply Chain
See how semiconductor leaders integrate 3D measurement at wafer-level testing, post-bond inspection, and final device verification. Uncover proven strategies for catching defects early, reducing scrap, and maintaining quality throughout multi-site supply chains.

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ISO Surface Texture