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Development of confocal-based techniques for shape measurements on structured surfaces containing dissimilar materials

Optical Metrology
ソフトウェアバイスプレジデント、物理学博士(光工学)、通信技術工学、電子工学) at Sensofar Metrology | Other articles

2004年よりSensofarの役員。\n豊富な経験を有する研究開発スペシャリストであり、1996年からCD6で研究開発エンジニアとして勤務。2001年のSensofar Tech SL創設以降ソフトウェアマネージャーを経て2017年にソフトウェアバイスプレジデントに就任。光学測定、表面形状測定、画像処理、コンピューターサイエンスを研究分野とする。2010年より銃器分析における3Dトポグラフィー分析の利用法の開発に携わる。


One of the applications, which is considered to be very difficult to carry out with most optical imaging profilers, is the shape and texture measurements of structured surfaces obtained from the superposition of various micro or sub-micrometric layers of dissimilar materials. Typical examples are the architectures of microelectronics samples made up of Si, SiO2, Si3N4, photoresists and metal layers. Because of the very different values of the index of refraction of the involved materials, visible light is reflected in the various interfaces. As a result, some reflected wavefronts are superposed giving rise to interference patterns, which are difficult to understand in terms of surface topography and layer thickness. In this paper we introduce a new method based on non-contact confocal techniques to measure the shape of structured samples. The method is based on the comparison of the axial responses obtained in areas of the surface where there is a layer and in other areas where there is just the substrate. To our knowledge, this approach enables the confocal profilers to measure the thickness of layers on the sub-micrometric scale for the first time.

3D shape and texture measurements