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Solutions >> IcPACK
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Related products:
· PLu 4300
· PLu CP
· PLu neox |
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| BGA |
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| Fast, non-invasive, non destructive, non contact surface inspection, three dimensional measure of Ball Gate Array. Discover the PLµ 2300 PC for a high throughput ball characterization, including presence, diameter, height and coplanarity. |
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| VIA AND SR OPEN |
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Via and SR open are important geometries to characterize during the production line of any ball package industry. If the diameter, height or Cu roughness are not well manufactured, the gate will not work.
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| CU ROUGHNESS |
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High lateral resolution profiling of the copper roughness and anchor characterization. |
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| CU TRACE |
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| Trace width, space and height are well profiled and automatically reported on different parts of the surface. |
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Sensofar-Tech, S.L.
T: +34 93 739 89 45
info@sensofar.com
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Fairs |
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CONTROL 2010
4. – 7.05.2010
Stuttgart, Germany
booth 1069 Hall 1
More info> |
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OPTATEC 2010
15. – 18.06.2010
Frankfurt, Germany
More info> |
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