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Solutions >> IcPACK
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Related products:
· PLu 4300
· PLu CP
· PLu neox |
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| BGA |
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| Fast, non-invasive, non destructive, non contact surface inspection, three dimensional measure of Ball Gate Array. Discover the PLµ 2300 PC for a high throughput ball characterization, including presence, diameter, height and coplanarity. |
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| VIA AND SR OPEN |
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Via and SR open are important geometries to characterize during the production line of any ball package industry. If the diameter, height or Cu roughness are not well manufactured, the gate will not work.
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| CU ROUGHNESS |
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High lateral resolution profiling of the copper roughness and anchor characterization. |
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| CU TRACE |
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| Trace width, space and height are well profiled and automatically reported on different parts of the surface. |
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Sensofar-Tech, S.L.
T: +34 93 700 14 92
info@sensofar.com
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Fairs |
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SPIE PHOTONICS WEST 2012
January 21-26, 2012
The Moscone Center
San Francisco, California, USA
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MDM 2012
February 14-16, 2012
Anaheim Convention Center
Anaheim, CA, USA
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MEDTEC EUROPE 2012
March 13-15, 2012
Messe Stuttgart
Stuttgart, Germany
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CONTROL 2012
May 8-11, 2012
Messe Stuttgart
Stuttgart, Germany
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