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SensoPRO
Industrial metrology
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It has never been so easy and fast to do a quality control in a production line. Thanks to SensoPRO software and PLu CP series Optical Profilers, the operator in the production line only needs to load the sample and follow guided instructions SensoPRO is a software product directly linked to the acquisition software of the PLu Optical Profilers series. By using acquisition recipes, the PLu CP system acquires 3D data in predefined positions
and transfers them to SensoPRO. SensoPRO receives the data and applies a predefined analysis algorithms to automatically extract sample critical features. There are some standard surface analysis algorithms, such as those for the semiconductor packaging industries. However, the analysis algorithms can be customly written following costumer requirements. Contact your
local distributor or Sensofar to ask how to solve your industrial and production line metrology needs. |
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| Advanced supervisor managing |
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| SensoPRO uses the predefined operator and supervisor PLu SensoSCAN user levels. The supervisor is able to define the acquisition recipes and the analysis procedures, including the nominal values and its tolerances. |
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| Guided operation |
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| The operator enters sample identification and procedure. Then he/she followsguided instructions to load the sample, automatically align, measure on each predefined point, and unload the sample. |
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| Excel report |
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| Results are given in excel format, with all the data for each measurement unit reported. Usign tolerances defined by the supervisor, a pass/fail message are also shown, minimizing the time of the operator to decide the next action for his production line. |
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| Semiconductor IC packaging module |
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| One of the available SensoPRO analysis modules is for the semiconductor IC packaging industry, were it is important to automatically characterize the panels that will be used for the Flip-Chip manufacturing. With the PLu CP system, it is possible to analyze up to 14 panels per hour, including load/unload, referencing, measurement and reporting. |
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| BGA |
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Full Flip Chip characterization.
• Number of balls
• Position for each ball
• Height for each ball
• Diameter for each ball
• Flip-Chip coplanarity |
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| Via ad SR/Open |
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Fast 3D measure of the hole.
• Top and Bottom diameter
• Via elipticity
• Height
• Top surface roughness
• Bottom via/SR roughness |
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| Traces |
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Fast localization and orientation of the traces.
• Trace height
• Trace width and space width
• Trace roughness
• Space roughness |
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| Copper substrate |
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| • Copper roughnes |
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| Anchor |
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• Anchor density
• Anchor area
• Anchor depth
• Anchor volume |
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