The PLµ 2300 has been designed as a modular system and many different configurations can be supplied,
from the single sensor head for OEM applications to the most complete and sophisticated arrangement.

Basic System
The basic operative setup comprises the sensor head and the open-loop Z-scan device, which are mounted
on a standard breadboard. This configuration provides the user with all the available imaging options (standard microscope, confocal and interferometry), as well as the highest resolution surface profiling techniques
(confocal, PSI and VSI). Thickness measurement as thin films and thick layers is also possible. The highest quality EPI, ELWD, SLWD, DI and TI Nikon objectives can be selected, with magnifications from 2,5X to 150X. To operate the PLµ 2300 using PSI and VSI algorithms, upgrading the hardware setup with a levelling tip-tilt stage and a vibration-isolation system is strongly recommended.

Microscopy imaging Real-time conventional image of both conventional and interferential objectives (MEM structure)	Confocal imaging High-depth discrimination confocal imaging using conventional objectives (MEM structure)
Topography Fast 3D data acquisition within the field of view of the objective (MEM structure)	Thickness Thickness measurement of transparent materials

+ XY Stage
The system can be upgraded with manual or motor X-Y stages, which are very useful for handling the sample
and positioning the features to be measured within the field of view. Using the X-Y motor stage option, the user can operate the PLµ 2300 as a fully automated coordinate measurement system. Also, extended profile and extended topography measurements can easily be acquired using the stitching algorithms included in the
software. A closed-loop PZT is also available as a high-accuracy z-scan option. By means of this device,
the PLµ 2300 achieves sub-nanometer vertical resolution (with interferometry) and calibration to traceable standards.