Multiple Objective Options
The EPI objective series have short working distances and high numerical apertures, thus providing the high accuracy and performance of the PLu for 3D surface measurement. These objectives are specially suited for smooth and flat samples such as MEMs and ICs, for surfaces with steep local slopes, such us microlenses and for surface characterisation such as particles. The Super Long Working Distance (SLWD) series are ideal for the measurement of high aspect ratio structures, steeply sloping samples and large steps. The Extra Long Working Distance (ELWD) series are a halfway solution.

Objective 50XSLWD/ELWD

Stitching capability
The stitching technique makes it possible to increase the acquired 3D surface measurement (topography) area beyond the objective's field of view. The PLu measures a sequence of equally spaced single topographies, maintaining a small amount of overlap to compensate for the misalignments produced by the stage errors.

Bumps on laser irradiated Silicon

Texture Measurements
The PLu is able to measure profiles up to100 mm with the stitching capability, enabling the evaluation of roughness and waviness
parameters according to ASME and DIN standards.

Measurement of Smooth and Rough Surfaces
The PLu is able to measure from smooth to very rough surfaces. Step height measurements can be made in dissimilar materials without any dependence on material characteristics. For large step measurements (over 20 mm), the Dual Scan allows acquisition in only the ranges close
to the top and the bottom of the sample.

Optical microlenses

User-Friendly Software Interface
Acquisition, filtering, analysis, surface characterisation and visualization capabilities based on Microsoft® Windows® 2000.