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SensoPRO

It has never been so easy and fast to do a quality control in a production line. Thanks to SensoPRO software and PLμ CP series Optical Profilers, the operator in the production line only needs to load the sample and follow guided instructions SensoPRO is a software product directly linked to the acquisition software of the PLμ Optical Profilers series. By using acquisition recipes, the PLμ CP system acquires 3D data in predefined positions
and transfers them to SensoPRO. SensoPRO receives the data and applies a predefined analysis algorithms to automatically extract sample critical features. There are some standard analysis algorithms, such as those for the semiconductor packaging industries. However, the analysis algorithms can be customly written following costumer requirements.. Contact your
local distributor or Sensofar to ask how to solve your production line metrology needs.

 

 

 

 

Advanced supervisor managing

SensoPRO uses the predefined operator and supervisor PLμ SensoSCAN user levels. The supervisor is able to define the acquisition recipes and the analysisprocedures, including the nominal values and its tolerances.

 

 

 

Guided operation

The operator enters sample identification and procedure. Then he/she followsguided instructions to load the sample, automatically align, measure on each predefined point, and unload the sample.

 


 

 

Excel report

Results are given in excel format, with all the data for each measurement unit reported. Usign tolerances defined by the supervisor, a pass/fail message are also shown, minimizing the time of the operator to decide the next action for his production line.

 

 

Semiconductor IC packaging module

One of the available SensoPRO analysis modules is for the semiconductor IC packaging industry, were it is important to automatically characterize the panels that will be used for the Flip-Chip manufacturing. With the PLμ CP system, it is possible to analyze up to 14 panels per hour, including load/unload, referencing, measurement and reporting.

 

 

BGA

Full Flip Chip characterization.
• Number of balls
• Position for each ball
• Height for each ball
• Diameter for each ball
• Flip-Chip coplanarity

 

Via ad SR/Open

Fast 3D measure of the hole.
• Top and Bottom diameter
• Via elipticity
• Height
• Top surface roughness
• Bottom via/SR roughness

 

Traces

Fast localization and orientation of the traces.
• Trace height
• Trace width and space width
• Trace roughness
• Space roughness

   

Copper substrate

• Copper roughnes

Anchor

• Anchor density
• Anchor area
• Anchor depth
• Anchor volume

 
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