PLµ CP

PLµ CP

Control of production PLµ series

Control of production PLμ series have been specially designed for fast characterization of large samples like panels containing PCBs, vias, flip-chip and traces analysis. Based on the well proven Sensofar’s optical profiling technology, you can now profile any surface with Interferometry techniques (PLμ 4300 CP) or the combination of both Confocal and Interferometry techniques (PLμ 2300 CP).

Non-Contact 3D Profiling
Confocal. Highest lateral resolution (0.1μm) and highest local slopes (up to 70o) ideal for wall angle analysis. PSI and VSI. Provides the highest vertical resolution (subnanometer resolution) and the fastest acquisition time. Spectroscopic reflectometer. Integrated technology that can be the perfect option for thickness of transparent materials with sub-nanometer resolution.

New stage design
Based on a gantry granite platform, the stage is able to accommodate up to 610x610mm samples. Multiple fixture and holder types offer wide range of possibilities to inspect different samples: from large panels (like PCBs) to several flip-chips, allowing the system to inspect and automatically report Via, Anchor, S/R and Trace dimensions.

Data acquisition and analysis
The well-known and established Sensofar’s software SensoSCAN®, allows the inspection of the surface, data acquisition and analysis. Fully integrated recipes for data acquisition on multiple places, autofocus, auto lighting and auto referencing functions!SensoPRO® analysis software is used to fully automate the production sequence. Loading, executing an acquisition recipe and performing online data analysis thus providing fast and reliable statistics on the quality of the production process.

Download PLµ CP brochure

Application Notes:

Characterization of surfaces.pdf

Solar cell surface characterization.pdf

Characterization of RGB filters in Flat Panel Display.pdf

Non contact measurement of optical surfaces.pdf

	BGA. Fast, non-invasive, three dimensional measure of Ball Gate Array. High throughput ball characterization, including presence, diameter, height and coplanarity.
	VIA and SR Open. Via and SR open are important geometries to characterize during the production line of any ball package industry. If the diameter, height or Cu roughness are not well manufactured, the gate will not work.
	Cu roughness. High lateral resolution profiling of the copper roughness.
	Cu Trace. Trace width, space and height are well profiled and automatically reported on different parts of the surface.
	Anchor Anchor regions are the pits of a surface into which material may flow. Anchor density and average area and depth are essential to the ball packaging industry.