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PLµ 4300

3D Optical profiler

High resolution thin film metrology

The Sensofar’s PLμ 4300 is an optical profiler for the 3D measurement of surfaces and thin films. The unique
combination of Interferometrical optical profiling and
Spectroscopic Reflectometry on the same sensorhead
makes the PLμ 4300 the only system in the market able to measure 3D profiles, roughness and thickness of opaque and transparent materials with sub-nanometer resolution.

 

Dual LED
Dual (blue and white) high power LED light source.

Dual Vertical Scanner
Dual vertical scanner consisting of a large travel range
motorized stage and an on-axis piezo. The motorized stage allows scanning up to several mm, while keeping sub nanometer resolution and very large sample size. The onaxis PZT is a capacitive closed-loop piezo translating the objective’s nosepiece. This allows the highest linearity and accuracy on the market, and extremely high repeatability.


High lateral resolution
Due to the use of blue wavelength and high numerical
aperture objectives, the highest lateral resolution for Critical Dimensional measures is achieved. L&S can be as low as 0.15 μm. The integrated Spectroscopic Reflectometer allows thin film measures with micrometric resolution

Thickness with unprecedented resolution
The optically integrated Spectroscopic Reflectometer opens an unprecedent combination of an optical profiler and thinfilm measurement technology on a single instrument. In real world, White Light interferometry is limited to measure thicknesses thicker than 500 nm. In contrast, Spectroscopic Reflectometer is able to measure thicknesses from 10 nm with 0.1 nm of resolution in a tenth of a second.

 


 

 

Download PLµ 4300 brochure

Application Notes:

Characterization of surfaces.pdf

Characterization of RGB filters in Flat Panel Display.pdf

 

 

 

BGA.
Fast, non-invasive, three dimensional measure of Ball Gate Array. High throughput ball characterization, including presence, diameter, height and coplanarity.
Flat Pannel Display
RGB characterization, photo spacer characterization. Step height, radius of curvature, aspheric components on the tip, height, roundness, perimeter, area, form factor, aspect
ratio, compacticity and orientation
MEMs
Accelerometer, gyroscopes, silicon membranes, pressure sensors, .micromotors, etc.
LED
Bump characterization, top and bottom diameter, height, wall angle.
 
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